Tiago Colombo joins Paays as VP Engineering

TORONTO, June 24, 2024: Paays Financial Technologies Inc. ("Paays") is pleased today to announce the hiring of Tiago Colombo, as the new VP Engineering.

"We are excited to announce Tiago's joining Paays as our new Technology Lead!", said David Fry, Founder and CEO of Paays. "Tiago's strong technical expertise, combined with significant engineering management skills, along with experience in both Enterprise and Consumer FinTech, make him the ideal person to take the Paays platform, and our customers, to the next level."

Tiago has an extensive background in software engineering and engineering management, in senior engineering roles at Borrowell in Canada, and FIS in Brazil. More recently, he was Head of Engineering at a Toronto-based travel-tech company, where he focused on developing software and managing teams, building ID and anti-fraud solutions for travel providers.

"I'm really pleased to be joining Paays," said Tiago. "What they've been able to accomplish to date with their platform of ID, Fraud, AML and Income Verification solutions, is nothing short of impressive. I can't wait to get started and help Paays and Paays customers continue to evolve and solve the complex fraud problems in financial services that exist today."